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| Serial | Technical Parameters | Technical capabilities |
| 1 | Max Layer count | 1-28 |
| 2 | Max board size | 450x1800mm (18"x71") |
| 3 | Min Board Thickness | 4 layers 0.38mm 15mil |
| 6layers 0.55mm 22mil | ||
| 8layers0.80mm 32mil | ||
| 10layers1.00mm 40mil | ||
| 4 | Copper Clad(Max.) | 6 oz(outer)/4 oz(inner) |
| 5 | Min line Width/space | 0.075mm 3mil |
| 6 | Min hole size | 0.15mm 6mil |
| 7 | PTH wall thickness | 0.025mm 1mil |
| 8 | PTH hole dia. tolerance | ±0.075mm 3mil |
| 9 | Non PTH hole dia. tolerance | ±0.05mm 2mil |
| 10 | Hole position deviation | ±0.05mm 2mil |
| 11 | Outline tolerance | ±0.10mm 4mil |
| 12 | Min S/M Pitch | 0.075mm 3mil |
| 13 | Twist and Bow | ≤1.0% |
| 14 | Insulation Resistance | ＞1012Ω |
| 15 | Test Voltage | 50~300v |
| 16 | Electric strength | ＞1.3KV/mm |
| 17 | Current breakdown | 10A |
| 18 | Peel strength | 1.4N/mm |
| 19 | Soldermask abrasion | ＞6H |
| 20 | Thermal stress | 288℃ 20Sec |
| 21 | Flammability | 94V-0 |
| 22 | Impedance Control | +/-5%(Differential) |
| 23 | Blind/Buried via | √ |
| 24 | Surface Finished | ENIG,ImAg,ImSn,OSP,Leaded HAL, Lead free HAL(SN100C), Flash Gold,Hard Gold |
| 25 | Materials | Getek ,Rogers ,Aluminum/Coper Based FR-4, High Tg FR-4,Teflon |
