1 |
20 micron nominal hole plating as per IPC class 3 |
BENEFITS
Increased reliability including improved z-axis expansion resistance. RISK OF NOT HAVING
Blow holes or outgassing, electrical continuity problems (inner layer separation, barrel cracking) during assembly or risk of field failures under load conditions. IPC Class 2 (standard for most factories) provides 20% less copper. |
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2 |
No track welding or open circuit repair |
BENEFITS
Reliability through perfect circuitry and security as no repair = no risk. RISK OF NOT HAVING
Poor repair can actually lead to open circuits being supplied. Even a ‘good’ repair has a risk of failure under load conditions (vibration etc.) leading to potential field failures. |
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3 |
Cleanliness requirements beyond those of IPC |
BENEFITS Improved cleanliess of the PCB influences increased reliability. |
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RISK OF NOT HAVING Residues on the boards, solder pick up, risk of conformal coating problems, ionic residues leading to risk of corrosion and contamination of the surfaces which are used for soldering – both potentially leading to reliability issues (poor solder joint / electrical failures) and ultimately increased potential for field failures. |
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4 |
Tight control on age of specific finishes |
BENEFITS
Solderability, reliability and less risk of moisture ingression.
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RISK OF NOT HAVING Solderability problems can occur as a result of metallurgical changes within the finish of old boards, whilst moisture ingression can lead to delamination, inner layer separation (open circuits) during assembly and/or when in the field. |
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5 |
Internationally known base materials used – no ‘local’ or unknown brands allowed |
BENEFITS Increased reliability and known performance. |
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RISK OF NOT HAVING
Poor mechanical properties mean the board doesn’t behave as expected during assembly conditions – for example: higher expansion properties leading to delamination / open circuits and also warpage problems. Reduced electrical characteristics can lead to poor impedance performance.
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6 |
Tolerance for copper clad laminate is IPC4101 class B/L |
BENEFITS
Tighter control of dielectric spacing provides less deviation in electrical performance expectations.
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RISK OF NOT HAVING Electrical characteristics may not be exactly as planned and units within the same batch can demonstrate greater variation in output / performance. |
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7 |
Defined soldermasks and ensuring accordance to IPC-SM-840 class T |
BENEFITS
NCAB Group approves ‘good’ materials to provide security in the ink and in knowing the soldermasks are covered within UL approvals.
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RISK OF NOT HAVING Poor inks can lead to problems with adhesion, resistance to solvents and hardness – all of which can see soldermask coming away from the board ultimately leading to corrosion of the copper circuitry. Poor insulation characteristics can lead to short circuits through unwanted electrical continuity / arcing. |
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8 |
Defined tolerances for profile, holes and other mechanical features |
BENEFITS
Tighter tolerances means improved dimensional quality of the product – better fit, form and function.
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RISK OF NOT HAVING Problems during assembly such as alignment / fit (press fit pin problems that are only found when the unit is fully assembled). Also problems with assembly into any housing due to increased deviation in dimensions. |
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9 |
NCAB Group specifies soldermask thickness – IPC does not |
BENEFITS
Better electrical insulation, less risk of flaking or loss adhesion and greater resilient to mechanical impact – wherever that may happen!
RISK OF NOT HAVING
Thin deposits of soldermask can lead to problems with adhesion, resistance to solvents and hardness – all of which can see soldermask coming away from the board ultimately leading to corrosion of copper circuitry. Poor insulation characteristics due to the thin deposit can lead to short circuits through unwanted electrical continuity / arcing. |
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10 |
NCAB Group defines cosmetic and repair requirements – IPC does not |
BENEFITS
Security as a result of love and care during the manufacturing process.
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RISK OF NOT HAVING Multiple scratches, minor damage, touch ups and repairs – a functional but perhaps unsightly board. If concerned over what canbe seen, then what risks are involved with what cannot be seen, and the potential impact on assembly or risk when in the field?? |
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11 |
Specific requirements of depth of via fill |
BENEFITS
A good quality filled via hole will provide less risk of rejection during the assembly process.
RISK OF NOT HAVING
Half filled via holes may trap chemical residues from the ENIG process which can cause problems such as solderability. Such via holes can also trap solderballs within the hole which can escape and cause short circuits either during assembly or in the field. |
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12 |
Peters SD2955 peelable as standard |
BENEFITS
The benchmark for peelable mask – no ‘local’ or cheap brands.
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RISK OF NOT HAVING Poor or cheap peelable can blister, melt, tear or simply set like concrete during assembly so that the peelable does not peel / does not work. |