High-frequency and high-speed performance: 5G signals mainly operate in the high-frequency and millimeter-wave frequency bands, requiring PCBs to achieve low-loss and low-latency signal transmission to ensure high-speed and stable data transmission.
High-precision wiring: To meet the requirements of high frequency and miniaturization, thinner line and smaller spacing need to be adopted, which poses high requirements for the precision of PCB manufacturing processes. At the same time, precise wiring must be ensured to control the signal impedance.
Good electromagnetic compatibility: Due to the integration of multiple high-frequency signals, effective measures need to be taken to suppress electromagnetic interference, such as reasonable shielding and filtering designs.
High-performance materials: Substrate materials with low dielectric constant and low loss factor need to be used to reduce the loss and distortion during signal transmission. Meanwhile, they should have good thermal conductivity to meet the heat dissipation requirements.
