This is a Samsung high-performance printed circuit board (PCB). Its key specifications are as follows:
Ultra-large PCB size 750 × 461mm and 3.2mm board thickness, the product is applied to 5G communication base stations.
Special base material requires: laminating RO4350B and RO4450F. It features a modular design, supporting complex circuit integration and flexible expansion.
High reliability: Complying with Samsung's strict process standards, it is suitable for high-frequency and high-power application requirements, ensuring the stability and durability of signal transmission.
This PCB can be widely applied in fields such as communication base stations, automated control equipment, and medical instruments. It is an ideal choice for the integration of large-scale electronic systems.
